Projects per year
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Dive into the research topics where Chung-Tse Wu is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Projects
- 1 Finished
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CAREER: SPECTRALLY-ENCODED ULTRAFAST MICROWAVE PANORAMIC CAMERA
National Science Foundation (National Science Foundation (NSF))
9/1/17 → 12/31/20
Project: Research project
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A Cost-Effective W-Band Antenna-in-Package Using IPD and PCB Technologies
Chiang, C. W., Wu, C. T. M., Liu, N. C., Liang, C. J. & Kuan, Y. C., May 1 2022, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 12, 5, p. 822-827 6 p.Research output: Contribution to journal › Article › peer-review
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Reconfigurable Non-Foster Elements and Squint-Free Beamforming Networks Using Active Transversal Filter-Based Negative Group Delay Circuit
Zhu, M. & Wu, C. T. M., Jan 1 2022, In: IEEE Transactions on Microwave Theory and Techniques. 70, 1, p. 222-231 10 p.Research output: Contribution to journal › Article › peer-review
4 Scopus citations -
Simultaneous Monitoring of Multiple People's Vital Sign Leveraging a Single Phased-MIMO Radar
Xu, Z., Shi, C., Zhang, T., Li, S., Yuan, Y., Wu, C. T. M., Chen, Y. & Petropulu, A., Sep 1 2022, In: IEEE Journal of Electromagnetics, RF and Microwaves in Medicine and Biology. 6, 3, p. 311-320 10 p.Research output: Contribution to journal › Article › peer-review
Open Access1 Scopus citations -
94 GHz CRLH Substrate-Integrated-Waveguide (SIW) Slot Antenna Array Using Silicon-Based IPD
Hsiao, C. Y., Wu, C. T. M. & Kuo, C. N., Aug 25 2021, 2021 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2021. Institute of Electrical and Electronics Engineers Inc., (2021 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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A 3-D Pillar-Based Electromagnetic Interference Shield for W-Band Antenna on Silicon Using Wire Bonding Technology
Chiang, C. W., Huang, R., Liang, C. J., Wu, C. T. M. & Kuan, Y. C., Dec 1 2021, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 11, 12, p. 2238-2241 4 p.Research output: Contribution to journal › Article › peer-review
Open Access