Abstract
This letter presents a 3-D electromagnetic interference (EMI) shield fabricated by a commercially available wire bonding technology to reduce EMI between a W -band (94 GHz) integrated-passive-device (IPD) antenna and other function blocks in a package. This EMI shield consists of vertical pillars fabricated by cutting out the wires created from the gold (Au) stud bumps, which are bonded on the nickel/gold (Ni/Au) pads surrounding the IPD antenna that adopts a cavity-backed slot structure. The heights of these wire pillars are made around 500~mu text{m} for being higher than that of a normal CMOS chip. The measured isolation ( -S21 ) from the transmitter (TX) IPD antenna to the receiver (RX) IPD antenna, each equipped with this EMI shield, demonstrates the EMI shielding functionality at 93.1-95.5 GHz and maximum shielding effectiveness (SE) of 16.92 dB at 94.2 GHz.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 2238-2241 |
| Number of pages | 4 |
| Journal | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| Volume | 11 |
| Issue number | 12 |
| DOIs | |
| State | Published - Dec 1 2021 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Industrial and Manufacturing Engineering
- Electrical and Electronic Engineering
Keywords
- 3-D
- W-band
- antenna on silicon
- antenna-in-package (AiP)
- cavity-backed slot antenna
- electromagnetic interference (EMI)
- integrated passive device (IPD)
- millimeter-wave (mm-Wave)
- pillar
- shielding
- vertical interconnection
- wafer level packaging (WLP)
- wire bonding