A detection method of stick-slip state on wafer transfer surface and its sensor design

Yanjie Liu, Jiang Wu, Kang Li, Haijun Han, Tao Liu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

In order to perceive stick-slip on during wafer transfer process, in this paper, a detection method was proposed and a force sensor basing on electromagnetic principle was applied to achieve this function. Through kinetic analysis, we chose second derivative of friction as detection judgment because friction varies in a high frequency within stick-slip state. Basing on the kinetic characteristics of force sensor, we added a circuit with the function of first derivation to obtain linear output of judgment. The results of model identification experiment indicate that second derivation function can be achieved within 2 kHz. In wafer transfer experiment, this sensor gave out a large amplitude and high frequency output when stick-slip appeared, which verified the effectiveness of this method for stick-slip detection in wafer transfer system.

Original languageEnglish (US)
Title of host publication2014 IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2014
PublisherIEEE Computer Society
Pages326-330
Number of pages5
ISBN (Print)9781479939787
DOIs
StatePublished - Jan 1 2014
Externally publishedYes
Event11th IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2014 - Tianjin, China
Duration: Aug 3 2014Aug 6 2014

Publication series

Name2014 IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2014

Other

Other11th IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2014
CountryChina
CityTianjin
Period8/3/148/6/14

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Electrical and Electronic Engineering
  • Mechanical Engineering

Keywords

  • Force sensor
  • Stick-slip detection
  • Wafer transfer robot

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  • Cite this

    Liu, Y., Wu, J., Li, K., Han, H., & Liu, T. (2014). A detection method of stick-slip state on wafer transfer surface and its sensor design. In 2014 IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2014 (pp. 326-330). [68856717] (2014 IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2014). IEEE Computer Society. https://doi.org/10.1109/ICMA.2014.6885717