@inproceedings{177743bef8df4c2f86b30ca9bf4c83dc,
title = "A fully integrated quartz MEMS VHF TCXO",
abstract = "We report on a 32-MHz quartz TCXO fully integrated with commercial CMOS electronics and vacuum packaged at wafer level using a low-temperature MEMS-after quartz process. The novel quartz resonator design provides for stress isolation from the CMOS substrate thereby yielding classical AT-cut f/T profiles and low hysteresis which can be compensated to < ± 0.2 ppm over temperature using on-chip third-order compensation circuity. The TCXO operates at low power of 2.5 mW and can be thinned to ≤ 300 μm as part of the wafer-level eutectic encapsulation. Full integration with large SOA CMOS wafers is possible using carrier wafer techniques.",
keywords = "AT-cut TCXO oscillators, CMOS integration, Quartz MEMS, Stress isolation, Temperature compensation, Wafer-level vacuum packaging",
author = "Kubena, {R. L.} and Stratton, {F. P.} and Nguyen, {H. D.} and Kirby, {D. J.} and Chang, {D. T.} and Joyce, {R. J.} and Yong, {Y. K.} and Garstecki, {J. F.} and Cross, {M. D.} and Seman, {S. E.}",
note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 2017 Joint Conference of the European Frequency and Time Forum and IEEE International Frequency Control Symposium, EFTF/IFC 2017 ; Conference date: 09-07-2017 Through 13-07-2017",
year = "2017",
month = oct,
day = "27",
doi = "10.1109/FCS.2017.8088803",
language = "English (US)",
series = "2017 Joint Conference of the European Frequency and Time Forum and IEEE International Frequency Control Symposium, EFTF/IFC 2017 - Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "68--71",
booktitle = "2017 Joint Conference of the European Frequency and Time Forum and IEEE International Frequency Control Symposium, EFTF/IFC 2017 - Proceedings",
address = "United States",
}