Molecular dynamics (MD) simulations were employed to investigate the pool boiling heat transfer of a liquid argon thin film on a flat, horizontal copper wall structured with vertical nanoscale pillars. The efficacy of phobic/philic nano-patterning for enhancing boiling heat transfer was scrutinized. Both nucleate and explosive boiling modes were considered. An error analysis demonstrated that the typical 2.5σ cutoff in MD simulations could under-predict heat flux by about 8.7 %, and 6σ cutoff was chosen here in order to maintain high accuracy. A new coordination number criterion was also introduced to better quantify evaporation characteristics. Results indicate that the argon-phobic/philic patterning tends to either have no effect, or decrease overall boiling heat flux, while the argon-philic nano-pillar/argon-philic wall shows the best heat transfer performance.
|Original language||English (US)|
|Number of pages||11|
|Journal||Heat and Mass Transfer/Waerme- und Stoffuebertragung|
|State||Published - Mar 1 2017|
All Science Journal Classification (ASJC) codes
- Condensed Matter Physics
- Fluid Flow and Transfer Processes