Abstract
A refractory stencil lift-off process utilizing Nb/Cu bilayers is described that is suitable for materials, such as the high-transition-temperature superconductors, which must be deposited on hot (up to 1000°C) substrates.
Original language | English (US) |
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Pages (from-to) | 1034-1035 |
Number of pages | 2 |
Journal | Applied Physics Letters |
Volume | 33 |
Issue number | 12 |
DOIs | |
State | Published - 1978 |
Externally published | Yes |
All Science Journal Classification (ASJC) codes
- Physics and Astronomy (miscellaneous)