A refractory lift-off process with applications to high-Tc superconducting circuits

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Abstract

A refractory stencil lift-off process utilizing Nb/Cu bilayers is described that is suitable for materials, such as the high-transition-temperature superconductors, which must be deposited on hot (up to 1000°C) substrates.

Original languageEnglish (US)
Pages (from-to)1034-1035
Number of pages2
JournalApplied Physics Letters
Volume33
Issue number12
DOIs
StatePublished - 1978
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy (miscellaneous)

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