Abstract
Subcritical crack growth in fused silica can be modeled as a stress assisted chemical reaction between water and strained bonds at the crack tip. The stress influences the crack growth rate by reducing the free energy of the activated complex. In principal, the stress changes both the activation enthalpy (energy) and entropy; however, the influence of stress on entropy has generally been ignored. The dynamic fatigue behavior of `pristine' optical fiber can be used to determine the fatigue kinetics parameters with unprecedented precision. It is shown that the entropy contribution is at least as significant as the enthalpy and therefore should not be ignored.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 95-101 |
| Number of pages | 7 |
| Journal | Proceedings of SPIE - The International Society for Optical Engineering |
| Volume | 3848 |
| State | Published - 1999 |
| Event | Optical Fiber Reliability and Testing - Boston, MA, USA Duration: Sep 19 1999 → Sep 20 1999 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering