An Ultrawide Ku-To W-Band Array Antenna Package Using Flip-Chipped Silicon Integrated Passive Device with Multilayer PCB Technology

Neda Khiabani, Ching Wen Chiang, Nai Chen Liu, Yen Cheng Kuan, Chung Tse Michael Wu

Research output: Contribution to journalArticlepeer-review

Abstract

A new antenna-in-package (AiP) solution for a tightly connected bowtie array antenna using a silicon-based integrated passive device (IPD) on a multilayer printed circuit board (PCB) is developed. The proposed IPD antenna is flip-chipped on the PCB through solder balls and gold studs, whereas a vertical coax-via-based feeding structure is used to provide differential excitation. The proposed 5 {5} array AiP shows a bandwidth of 18.58-100 GHz with differential VSWR \le3.5 when only exciting the central antenna element. The simulations are validated through the fabrication and measurement of prototypes, demonstrating a reasonable agreement in differential VSWR and radiation patterns.

Original languageEnglish (US)
Article number9410566
Pages (from-to)861-864
Number of pages4
JournalIEEE Microwave and Wireless Components Letters
Volume31
Issue number7
DOIs
StatePublished - Jul 2021

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Keywords

  • Antenna feeds
  • antenna-in-package (AiP)
  • coax-via
  • integrated passive device~(IPD) technology
  • ultrawideband array antennas

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