Automated visual inspection of SMDs in an industrial environment

E. K. Teoh; D. P. Mital

doi:10.1117/12.138484

Automated visual inspection of SMDs in an industrial environment

Research output: Contribution to journal › Conference article › peer-review

Abstract

This paper presents the techniques used to inspect for defects on Surface Mount PCBs. Focusses were made on five different types of defects, namely, missing components, misalignment, wrong orientation of I.C. chips, wrong parts and poor solder joints. Thus five separate algorithms had been developed to detect these faults. The technique of windowing was employed to reduce the amount of redundant data to be processed. Preprocessing functions like convolution as well as all image processing tasks are performed on the window regions only, saving tremendously on computation time. Experimental results showed that these algorithms are reliable, fast and cost-effective.

Original language	English (US)
Pages (from-to)	38-47
Number of pages	10
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	1713
DOIs	https://doi.org/10.1117/12.138484
State	Published - 1992
Externally published	Yes
Event	International Conference on Manufacturing Automation 1992 - Hong Kong, Hong Kong Duration: Aug 1 1992 → …

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Computer Science Applications
Applied Mathematics
Electrical and Electronic Engineering

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10.1117/12.138484

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abstract = "This paper presents the techniques used to inspect for defects on Surface Mount PCBs. Focusses were made on five different types of defects, namely, missing components, misalignment, wrong orientation of I.C. chips, wrong parts and poor solder joints. Thus five separate algorithms had been developed to detect these faults. The technique of windowing was employed to reduce the amount of redundant data to be processed. Preprocessing functions like convolution as well as all image processing tasks are performed on the window regions only, saving tremendously on computation time. Experimental results showed that these algorithms are reliable, fast and cost-effective.",

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AB - This paper presents the techniques used to inspect for defects on Surface Mount PCBs. Focusses were made on five different types of defects, namely, missing components, misalignment, wrong orientation of I.C. chips, wrong parts and poor solder joints. Thus five separate algorithms had been developed to detect these faults. The technique of windowing was employed to reduce the amount of redundant data to be processed. Preprocessing functions like convolution as well as all image processing tasks are performed on the window regions only, saving tremendously on computation time. Experimental results showed that these algorithms are reliable, fast and cost-effective.

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JF - Proceedings of SPIE - The International Society for Optical Engineering

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ER -

Automated visual inspection of SMDs in an industrial environment

Abstract

All Science Journal Classification (ASJC) codes

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