Co-integration of a quartz OCXO and Si MEMS inertial sensors for improved navigational accuracy

R. L. Kubena, F. P. Stratton, L. X. Huang, R. J. Joyce, D. J. Kirby, D. T. Chang, Y. K. Yong

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Scopus citations

Abstract

On-chip integration of quartz resonators with Si devices opens new opportunities for microsystem miniaturization and enhanced performance. In addition to integrating with electronics, the integration of piezoelectric quartz resonators with other sensors of different material composition is also possible. In this paper, we demonstrate that a VHF SC-cut quartz resonator can be integrated within a high-aspect-ratio Si disk gyro with on-chip heating for locally ovenizing both devices in the same wafer-level vacuum cavity. The SC-cut OCXO can be used to lock the frequency and temperature of the gyro to ≤ 2 ppb and ≤50 μΧ, respectively, for improved accuracy.

Original languageEnglish (US)
Title of host publication2016 IEEE International Frequency Control Symposium, IFCS 2016 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781509020911
DOIs
StatePublished - Aug 16 2016
Event70th IEEE International Frequency Control Symposium, IFCS 2016 - New Orleans, United States
Duration: May 9 2016May 12 2016

Publication series

Name2016 IEEE International Frequency Control Symposium, IFCS 2016 - Proceedings

Other

Other70th IEEE International Frequency Control Symposium, IFCS 2016
Country/TerritoryUnited States
CityNew Orleans
Period5/9/165/12/16

All Science Journal Classification (ASJC) codes

  • Computer Networks and Communications
  • Instrumentation

Keywords

  • Quartz MEMS
  • SC-cut oscillators
  • Si MEMS
  • Si disk resonator gyro
  • frequency locking
  • wafer-level ovenization

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