Combined experimental and numerical study for a multiple-microchannel heat transfer system

Multiple microchannel heat sinks for potential use for heat removal from localized thermal sources such as electronic chips are studied experimentally and numerically to characterize their thermal performance. An approach based on combined experimental and numerical modeling is presented. The numerical simulation is driven by experimental data, which are obtained concurrently, to obtain realistic, accurate, and validated numerical models. The ultimate goal is to design and optimize such thermal systems. The experimental setup was established and liquid flow in the multiple microchannels was studied under different flow rates and heat influx. The temperature variation versus time was recorded by thermocouples, from which the time needed to reach steady state was determined. The measured temperatures under steady-state conditions were compared with those from three-dimensional steady-state numerical simulations for the same boundary and initial conditions. The experimental data were employed for the validation of the numerical model. In case of significant discrepancy, the numerical model was improved, starting initially with a relatively simple model. Fairly good agreement between the experimental and simulation results was finally obtained, indicating the main considerations for an accurate model. The numerical model also served to provide inputs that could be employed to improve and modify the experimental arrangement. The main focus of this work is on the combined experimental and numerical approach to model and simulate thermal systems, such as the one considered here, particularly in regions where additional transport mechanisms are important. Consequently, low flow rates are employed to consider other transport mechanisms and make this combined experimental-numerical approach useful for design and optimization.