Multiple microchannel heat sinks for potential use for electronic chip cooling are studied experimentally and numerically to characterize their thermal performance. The numerical simulation is driven by experimental data, which are obtained concurrently, to obtain realistic, accurate and validated numerical models. The ultimate goal is to design and optimize thermal systems. The experimental setup was established and liquid flow in the multiple microchannels was studied under different flow rates and heat influx. The temperature variation versus time was recorded by thermocouples, from which the time needed to reach steady state was determined. Temperature variations under steady state conditions were compared with three-dimensional steady state numerical simulation for the same boundary and initial conditions. The experimental data served as input parameters for the validation of the numerical model. In case of discrepancy, the numerical model was improved. A fairly good agreement between the experimental and simulation results was obtained. The numerical model also served to provide input that could be employed to improve and modify the experimental arrangement.