Deep Melting of Silicon Wafers

Lynn O. Wilson, G. K. Celler, L. E. Trimble

Research output: Contribution to journalArticle

2 Scopus citations

Abstract

A one-dimensional analytical solution is derived for melt propagation in silicon wafers uniformly heated with lamp radiation from one side and radiatively cooled from both sides. Only the case of deep melting is considered, beyond the power threshold required for elimination of all solid inclusions at the irradiated surface. The solutions for bulk silicon and for silicon with a buried oxide layer are in reasonable agreement with the experimental data. The results are relevant to formation of single crystalline silicon films on SiO2by crystallization from the melt.

Original languageEnglish (US)
Pages (from-to)383-389
Number of pages7
JournalJournal of the Electrochemical Society
Volume133
Issue number2
DOIs
StatePublished - Feb 1986
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Renewable Energy, Sustainability and the Environment
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Materials Chemistry

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