Designs of multiple microchannel heat transfer systems

Jingru Zhang, Po Ting Lin, Yogesh Jaluria

Research output: Chapter in Book/Report/Conference proceedingConference contribution

12 Scopus citations

Abstract

In this paper, two different configurations of multiple microchannel heat sinks with fluid flow are investigated for electronic cooling: straight and U-shaped channel designs. Numerical models are utilized to study the multiphysics behavior in the microchannels and validated by comparisons with experimental results. Three responses, including thermal resistance, pressure drop, and maximum temperature, are parametrically modeled with respect to various variables such as dimensions of the channels, total number of channels, and flow rate. Multi-objective optimization problems, which minimize the thermal resistance and the pressure drop simultaneously, are formulated and studied. Physical constraints in terms of channel height, maximum temperature, and pressure are further investigated. The Pareto frontiers are studied and the trade-off behavior between the thermal resistance and the pressure drop are discussed.

Original languageEnglish (US)
Title of host publicationNano and Micro Materials, Devices and Systems; Microsystems Integration
PublisherAmerican Society of Mechanical Engineers (ASME)
Pages875-887
Number of pages13
ISBN (Print)9780791854976
DOIs
StatePublished - 2011
EventASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011 - Denver, CO, United States
Duration: Nov 11 2011Nov 17 2011

Publication series

NameASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011
Volume11

Other

OtherASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011
Country/TerritoryUnited States
CityDenver, CO
Period11/11/1111/17/11

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering

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