TY - GEN
T1 - Designs of multiple microchannel heat transfer systems
AU - Zhang, Jingru
AU - Lin, Po Ting
AU - Jaluria, Yogesh
PY - 2011
Y1 - 2011
N2 - In this paper, two different configurations of multiple microchannel heat sinks with fluid flow are investigated for electronic cooling: straight and U-shaped channel designs. Numerical models are utilized to study the multiphysics behavior in the microchannels and validated by comparisons with experimental results. Three responses, including thermal resistance, pressure drop, and maximum temperature, are parametrically modeled with respect to various variables such as dimensions of the channels, total number of channels, and flow rate. Multi-objective optimization problems, which minimize the thermal resistance and the pressure drop simultaneously, are formulated and studied. Physical constraints in terms of channel height, maximum temperature, and pressure are further investigated. The Pareto frontiers are studied and the trade-off behavior between the thermal resistance and the pressure drop are discussed.
AB - In this paper, two different configurations of multiple microchannel heat sinks with fluid flow are investigated for electronic cooling: straight and U-shaped channel designs. Numerical models are utilized to study the multiphysics behavior in the microchannels and validated by comparisons with experimental results. Three responses, including thermal resistance, pressure drop, and maximum temperature, are parametrically modeled with respect to various variables such as dimensions of the channels, total number of channels, and flow rate. Multi-objective optimization problems, which minimize the thermal resistance and the pressure drop simultaneously, are formulated and studied. Physical constraints in terms of channel height, maximum temperature, and pressure are further investigated. The Pareto frontiers are studied and the trade-off behavior between the thermal resistance and the pressure drop are discussed.
UR - https://www.scopus.com/pages/publications/84869180852
UR - https://www.scopus.com/pages/publications/84869180852#tab=citedBy
U2 - 10.1115/imece2011-62539
DO - 10.1115/imece2011-62539
M3 - Conference contribution
AN - SCOPUS:84869180852
SN - 9780791854976
T3 - ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011
SP - 875
EP - 887
BT - Nano and Micro Materials, Devices and Systems; Microsystems Integration
PB - American Society of Mechanical Engineers (ASME)
T2 - ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011
Y2 - 11 November 2011 through 17 November 2011
ER -