Detailed modeling of temperature rise in giant magnetoresistive sensor during an electrostatic discharge event

Y. Yang; S. Shojaeizadeh; J. A. Bain; J. G. Zhu; M. Asheghi

doi:10.1063/1.1652426

Detailed modeling of temperature rise in giant magnetoresistive sensor during an electrostatic discharge event

Y. Yang, S. Shojaeizadeh, J. A. Bain, J. G. Zhu, M. Asheghi

Research output: Contribution to journal › Article › peer-review

11 Scopus citations

Abstract

A three-dimensional finite element analysis method was used to investigate the thermal response of the giant magnetoresistance (GMR) read head excessive current/voltage during an electrostatic discharge (ESD) event. The temperature in the GMR was found to increase sharply with the reduction in the GMR dimensions. It was found that the thermal properties of the GMR elements and the gap materials are important for the accurate prediction of the temperature filed in a GMR head during ESD events. The results show that the perpendicular-to-plane configurations, can sustain high ESD voltages.

Original language	English (US)
Pages (from-to)	6780-6782
Number of pages	3
Journal	Journal of Applied Physics
Volume	95
Issue number	11 II
DOIs	https://doi.org/10.1063/1.1652426
State	Published - Jun 1 2004
Externally published	Yes

All Science Journal Classification (ASJC) codes

General Physics and Astronomy

Access to Document

10.1063/1.1652426

Cite this

@article{e47bafa28a224ae4968285fdc5090ed2,

title = "Detailed modeling of temperature rise in giant magnetoresistive sensor during an electrostatic discharge event",

abstract = "A three-dimensional finite element analysis method was used to investigate the thermal response of the giant magnetoresistance (GMR) read head excessive current/voltage during an electrostatic discharge (ESD) event. The temperature in the GMR was found to increase sharply with the reduction in the GMR dimensions. It was found that the thermal properties of the GMR elements and the gap materials are important for the accurate prediction of the temperature filed in a GMR head during ESD events. The results show that the perpendicular-to-plane configurations, can sustain high ESD voltages.",

author = "Y. Yang and S. Shojaeizadeh and Bain, {J. A.} and Zhu, {J. G.} and M. Asheghi",

year = "2004",

month = jun,

day = "1",

doi = "10.1063/1.1652426",

language = "English (US)",

volume = "95",

pages = "6780--6782",

journal = "Journal of Applied Physics",

issn = "0021-8979",

publisher = "American Institute of Physics",

number = "11 II",

}

TY - JOUR

T1 - Detailed modeling of temperature rise in giant magnetoresistive sensor during an electrostatic discharge event

AU - Yang, Y.

AU - Shojaeizadeh, S.

AU - Bain, J. A.

AU - Zhu, J. G.

AU - Asheghi, M.

PY - 2004/6/1

Y1 - 2004/6/1

N2 - A three-dimensional finite element analysis method was used to investigate the thermal response of the giant magnetoresistance (GMR) read head excessive current/voltage during an electrostatic discharge (ESD) event. The temperature in the GMR was found to increase sharply with the reduction in the GMR dimensions. It was found that the thermal properties of the GMR elements and the gap materials are important for the accurate prediction of the temperature filed in a GMR head during ESD events. The results show that the perpendicular-to-plane configurations, can sustain high ESD voltages.

AB - A three-dimensional finite element analysis method was used to investigate the thermal response of the giant magnetoresistance (GMR) read head excessive current/voltage during an electrostatic discharge (ESD) event. The temperature in the GMR was found to increase sharply with the reduction in the GMR dimensions. It was found that the thermal properties of the GMR elements and the gap materials are important for the accurate prediction of the temperature filed in a GMR head during ESD events. The results show that the perpendicular-to-plane configurations, can sustain high ESD voltages.

UR - http://www.scopus.com/inward/record.url?scp=2942687654&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=2942687654&partnerID=8YFLogxK

U2 - 10.1063/1.1652426

DO - 10.1063/1.1652426

M3 - Article

AN - SCOPUS:2942687654

SN - 0021-8979

VL - 95

SP - 6780

EP - 6782

JO - Journal of Applied Physics

JF - Journal of Applied Physics

IS - 11 II

ER -

Detailed modeling of temperature rise in giant magnetoresistive sensor during an electrostatic discharge event

Abstract

All Science Journal Classification (ASJC) codes

Access to Document

Other files and links

Fingerprint

Cite this