Device processing technology for free-space optical interconnect system

M. Oren, A. McCarthy, F. Tooley, A. E. Laprise, D. Plant, A. Kirk, Yicheng Lu, J. Zhao

Research output: Contribution to journalArticle

Abstract

A device processing technology was developed for fabricating arrays of detectors/modulators chips used in a free-space optical interconnect system. The arrays are fabricated onto a GaAs/AlGaAs multi quantum well (MQW) epitaxial layer having an in-plane anisotropic strain. The packaged module array consists of a strain inducing substrate onto which the GaAs epitaxial layer is transferred, and bonded to a Si CMOS driver by flip chip technology. The module is attached to a printed circuit board(PCB), and two such boards were mounted into a free space optical interconnect demonstration system.

Original languageEnglish (US)
Pages (from-to)886-889
Number of pages4
JournalProceedings - Electronic Components and Technology Conference
DOIs
Publication statusPublished - Jan 1 2001

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All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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