A device processing technology was developed for fabricating arrays of detectors/modulators chips used in a free-space optical interconnect system. The arrays are fabricated onto a GaAs/AlGaAs multi quantum well (MQW) epitaxial layer having an in-plane anisotropic strain. The packaged module array consists of a strain inducing substrate onto which the GaAs epitaxial layer is transferred, and bonded to a Si CMOS driver by flip chip technology. The module is attached to a printed circuit board(PCB), and two such boards were mounted into a free space optical interconnect demonstration system.
|Original language||English (US)|
|Number of pages||4|
|Journal||Proceedings - Electronic Components and Technology Conference|
|Publication status||Published - Jan 1 2001|
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering