Effect of nanomaterial shape on fabrication of conformal circuits

Harish Devaraj, Rajiv Malhotra

Research output: Contribution to journalConference articlepeer-review


This paper investigates how the change in nanomaterial (NM) shape influences resistance evolution during conformal interconnect fabrication via sequential Vacuum-forming and Flash Light Sintering (FLS) approach. The NM shape in the conformal circuit is tuned by mixing nanowires (NW) with nanoflakes (NF) or nanospheres (NS) at different mixing ratios. The change in line resistance post-forming and post-sintering for any given mixing ratio is studied in greater depth using SEM characterization, UV-Vis spectrophotometry and thermal measurements. For optimal NM mixing ratio and process parameters, the fabricated circuit achieves electrical resistivity of 55.4 µ?-cm within 30 seconds on a wall inclined at 600 to the horizontal with a width to height aspect ratio of 2.5:1.

Original languageEnglish (US)
Pages (from-to)251-255
Number of pages5
JournalProcedia Manufacturing
StatePublished - 2020
Event48th SME North American Manufacturing Research Conference, NAMRC 48 - Cincinnati, United States
Duration: Jun 22 2020Jun 26 2020

All Science Journal Classification (ASJC) codes

  • Industrial and Manufacturing Engineering
  • Artificial Intelligence


  • Conformal Interconnects
  • Nanomaterial shape
  • Optical Sintering
  • Vacuum-forming


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