TY - GEN
T1 - Effects of warpage on fatigue reliability of solder bumps
T2 - 2008 58th Electronic Components and Technology Conference, ECTC
AU - Tan, Wei
AU - Ume, I. Charles
AU - Hung, Ying
AU - Wu, C. F.Jeff
PY - 2008
Y1 - 2008
N2 - Out-of-plane displacement (warpage) has been a major thermomechanical reliability concern for board-level electronic packages. Printed wiring board (PWB) and component warpage results principally from CTE mismatch among the materials that make up the PWB assembly (PWBA). Warpage occurring during surface-mount assembly reflow processes and normal operations may lead to severe solder bump reliability problems. In this research, the effect of initial PWB warpage on the low cycle thermal fatigue reliability of the solder bumps in plastic ball grid array (PBGA) packages was studied using experimental and analytical methods. A real-time projection moiré warpage measurement system was used to measure the surface topology of PWBA samples at different temperatures. The thermal fatigue reliability of solder bumps was evaluated from experimental thermal cycling tests and finite element simulation results. Three-dimensional (3-D) models of PWBAs with varying board warpage were used to estimate the solder bump fatigue life for different types of PBGAs mounted on PWBs. In order to improve the accuracy of FE results, the projection moiré method was used to measure the initial warpage of PWBs, and this warpage was used as a geometric input to the FEM. The simulation results were validated and correlated with the experimental results obtained using the projection moiré technique and accelerated thermal cycling tests. An advanced prediction model was generated to predict board level solder bump fatigue life based on the initial PWB warpage, package dimensions and locations, and solder bump materials.
AB - Out-of-plane displacement (warpage) has been a major thermomechanical reliability concern for board-level electronic packages. Printed wiring board (PWB) and component warpage results principally from CTE mismatch among the materials that make up the PWB assembly (PWBA). Warpage occurring during surface-mount assembly reflow processes and normal operations may lead to severe solder bump reliability problems. In this research, the effect of initial PWB warpage on the low cycle thermal fatigue reliability of the solder bumps in plastic ball grid array (PBGA) packages was studied using experimental and analytical methods. A real-time projection moiré warpage measurement system was used to measure the surface topology of PWBA samples at different temperatures. The thermal fatigue reliability of solder bumps was evaluated from experimental thermal cycling tests and finite element simulation results. Three-dimensional (3-D) models of PWBAs with varying board warpage were used to estimate the solder bump fatigue life for different types of PBGAs mounted on PWBs. In order to improve the accuracy of FE results, the projection moiré method was used to measure the initial warpage of PWBs, and this warpage was used as a geometric input to the FEM. The simulation results were validated and correlated with the experimental results obtained using the projection moiré technique and accelerated thermal cycling tests. An advanced prediction model was generated to predict board level solder bump fatigue life based on the initial PWB warpage, package dimensions and locations, and solder bump materials.
UR - http://www.scopus.com/inward/record.url?scp=51349086506&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=51349086506&partnerID=8YFLogxK
U2 - 10.1109/ECTC.2008.4549959
DO - 10.1109/ECTC.2008.4549959
M3 - Conference contribution
AN - SCOPUS:51349086506
SN - 9781424422302
T3 - Proceedings - Electronic Components and Technology Conference
SP - 131
EP - 138
BT - 2008 Proceedings 58th Electronic Components and Technology Conference, ECTC
Y2 - 27 May 2008 through 30 May 2008
ER -