Elastic stress fields caused by sliding microindentation of brittle materials

Y. Ahn, T. N. Farris, S. Chandrasekar

Research output: Chapter in Book/Report/Conference proceedingChapter

6 Scopus citations

Abstract

An analytical model of the stress field caused by sliding microindentation of brittle materials is developed. The complete stress field is treated as the superposition of applied normal and tangential forces with a sliding blister approximation of the localized inelastic deformation occurring just underneath the indenter. It is shown that lateral cracking is produced by the sliding blister stress field and that median cracking is caused by the applied contact forces. The model is combined with experimental volume change measurements to show that the relative magnitude of tensile stresses governing lateral crack and median crack growth varies with the magnitude of the applied load. This prediction is consistent with the different regimes of cracking observed under a sliding pointed indenter in soda-lime glass and other brittle solids.

Original languageEnglish (US)
Title of host publicationNIST Special Publication
PublisherPubl by Natl Inst of Standards & Technology
Pages71-81
Number of pages11
Edition847
StatePublished - Jun 1993
Externally publishedYes
EventProceedings of the International Conference on Machining of Advanced Materials - Gaithersburg, MD, USA
Duration: Jul 20 1993Jul 22 1993

Other

OtherProceedings of the International Conference on Machining of Advanced Materials
CityGaithersburg, MD, USA
Period7/20/937/22/93

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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