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Engineering substrates for 3d integration of iii-v and CMOS
K. J. Herrick, T. E. Kazior, J. Laroche, A. W.K. Liu, D. Lubyshev, J. M. Fastenau, M. Urteaga, W. Ha, J. Bergman, B. Brar, M. T. Bulsara, E. A. Fitzgerald, D. Clark, D. Smith, R. F. Thompson, N. Daval, G. K. Celler
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
6
Scopus
citations