Inkjet-printed microshell encapsulation: A new zero-level packaging technology

E. S. Park, J. Jeon, V. Subramanian, T. J.King Liu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Scopus citations

Abstract

A low-thermal-budget (CMOS-compatible) process for microshell encapsulation of MEMS devices is proposed. Inkjet-printing of silver (Ag) nanoparticle ink is demonstrated to form porous microshells through which sacrificial oxide (SiO2) can be selectively removed to release MEMS structures. A second inkjet printing process using finer gold (Au) nanoparticle ink is demonstrated to effectively seal the microshells. The mechanical strength of a printed microshell (∼3 μm thick) is sufficient for encapsulating regions greater than 1 mm in length.

Original languageEnglish (US)
Title of host publication2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012
Pages357-360
Number of pages4
DOIs
StatePublished - 2012
Externally publishedYes
Event2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012 - Paris, France
Duration: Jan 29 2012Feb 2 2012

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Other

Other2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012
Country/TerritoryFrance
CityParis
Period1/29/122/2/12

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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