Abstract
Three dimensional mixed convection flow in a horizontal rectangular duct at low Reynolds numbers 5 ≤ Re ≤ 100 has been investigated numerically. Multiple strip heat sources are flushed-mounted on the bottom surface, modeling IC chips on PCBs. Two different flow patterns were observed. For Re ≥ 20, and Gr ≤ 1.5 × 10 4, only steady longitudinal rolls appear in the channel. The discontinuous deployment of heat sources on the bottom makes the longitudinal rolls expand and shrink periodically. The unsteady flow consists of steady longitudinal rolls near the side walls and traveling transverse rolls at the core region of the channel. The traveling velocity of the transverse rolls was found to be equal to the mean velocity of the forced flow. The implications of these observations to the cooling of electronic equipment are discussed.
Original language | English (US) |
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Pages (from-to) | 13-25 |
Number of pages | 13 |
Journal | American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD |
Volume | 369 |
Issue number | 7 |
State | Published - 2001 |
Event | 2001 ASME International Mechanical Engineering Congress and Exposition - New York, NY, United States Duration: Nov 11 2001 → Nov 16 2001 |
All Science Journal Classification (ASJC) codes
- Mechanical Engineering
- Fluid Flow and Transfer Processes