Integrating Electronics with Solid Structures Using 3D Circuits

Benjamin Baldwin; Vivek Kolli; Keith Lehman; Allison Li; Charlotte Lin; Rajiv Malhotra; Harish Devaraj

doi:10.1109/URTC49097.2019.9660506

Integrating Electronics with Solid Structures Using 3D Circuits

Benjamin Baldwin, Vivek Kolli, Keith Lehman, Allison Li, Charlotte Lin, Rajiv Malhotra, Harish Devaraj

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Water safety is a critical issue facing many parts of the world today, but current water quality detection methods are complicated and cumbersome. 3D printing has allowed for the integration of electronics into solid structures, creating new products that promote consumer access to sensor data. A 3D printed water bottle was built to utilize this technology by integrating sensors to test pH, turbidity, and total dissolved solids (TDS) of a liquid, making basic water safety testing accessible for the general public. The bottle was controlled with an Arduino Uno unit and included binary LED indicators to display a relative assessment of water quality. Values were recorded from each sensor by testing various liquids. This product was determined to be accurate in measuring water quality factors when compared to known values, and is an efficient method for users to assess water safety in a compact form.

Original language	English (US)
Title of host publication	2019 IEEE MIT Undergraduate Research Technology Conference, URTC 2019
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781728158181
DOIs	https://doi.org/10.1109/URTC49097.2019.9660506
State	Published - 2019
Externally published	Yes
Event	2019 IEEE MIT Undergraduate Research Technology Conference, URTC 2019 - Cambridge, United States Duration: Oct 11 2019 → Oct 13 2019

Publication series

Name	2019 IEEE MIT Undergraduate Research Technology Conference, URTC 2019

Conference

Conference	2019 IEEE MIT Undergraduate Research Technology Conference, URTC 2019
Country/Territory	United States
City	Cambridge
Period	10/11/19 → 10/13/19

All Science Journal Classification (ASJC) codes

Artificial Intelligence
Computer Vision and Pattern Recognition
Computer Science Applications
Human-Computer Interaction
Control and Optimization

Access to Document

10.1109/URTC49097.2019.9660506

Cite this

Baldwin, B., Kolli, V., Lehman, K., Li, A., Lin, C., Malhotra, R., & Devaraj, H. (2019). Integrating Electronics with Solid Structures Using 3D Circuits. In 2019 IEEE MIT Undergraduate Research Technology Conference, URTC 2019 (2019 IEEE MIT Undergraduate Research Technology Conference, URTC 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/URTC49097.2019.9660506

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title = "Integrating Electronics with Solid Structures Using 3D Circuits",

abstract = "Water safety is a critical issue facing many parts of the world today, but current water quality detection methods are complicated and cumbersome. 3D printing has allowed for the integration of electronics into solid structures, creating new products that promote consumer access to sensor data. A 3D printed water bottle was built to utilize this technology by integrating sensors to test pH, turbidity, and total dissolved solids (TDS) of a liquid, making basic water safety testing accessible for the general public. The bottle was controlled with an Arduino Uno unit and included binary LED indicators to display a relative assessment of water quality. Values were recorded from each sensor by testing various liquids. This product was determined to be accurate in measuring water quality factors when compared to known values, and is an efficient method for users to assess water safety in a compact form.",

author = "Benjamin Baldwin and Vivek Kolli and Keith Lehman and Allison Li and Charlotte Lin and Rajiv Malhotra and Harish Devaraj",

note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 2019 IEEE MIT Undergraduate Research Technology Conference, URTC 2019 ; Conference date: 11-10-2019 Through 13-10-2019",

year = "2019",

doi = "10.1109/URTC49097.2019.9660506",

language = "English (US)",

series = "2019 IEEE MIT Undergraduate Research Technology Conference, URTC 2019",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

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Baldwin, B, Kolli, V, Lehman, K, Li, A, Lin, C, Malhotra, R & Devaraj, H 2019, Integrating Electronics with Solid Structures Using 3D Circuits. in 2019 IEEE MIT Undergraduate Research Technology Conference, URTC 2019. 2019 IEEE MIT Undergraduate Research Technology Conference, URTC 2019, Institute of Electrical and Electronics Engineers Inc., 2019 IEEE MIT Undergraduate Research Technology Conference, URTC 2019, Cambridge, United States, 10/11/19. https://doi.org/10.1109/URTC49097.2019.9660506

Integrating Electronics with Solid Structures Using 3D Circuits. / Baldwin, Benjamin; Kolli, Vivek; Lehman, Keith et al.

2019 IEEE MIT Undergraduate Research Technology Conference, URTC 2019. Institute of Electrical and Electronics Engineers Inc., 2019. (2019 IEEE MIT Undergraduate Research Technology Conference, URTC 2019).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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AU - Lehman, Keith

AU - Li, Allison

AU - Lin, Charlotte

AU - Malhotra, Rajiv

AU - Devaraj, Harish

PY - 2019

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AB - Water safety is a critical issue facing many parts of the world today, but current water quality detection methods are complicated and cumbersome. 3D printing has allowed for the integration of electronics into solid structures, creating new products that promote consumer access to sensor data. A 3D printed water bottle was built to utilize this technology by integrating sensors to test pH, turbidity, and total dissolved solids (TDS) of a liquid, making basic water safety testing accessible for the general public. The bottle was controlled with an Arduino Uno unit and included binary LED indicators to display a relative assessment of water quality. Values were recorded from each sensor by testing various liquids. This product was determined to be accurate in measuring water quality factors when compared to known values, and is an efficient method for users to assess water safety in a compact form.

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Integrating Electronics with Solid Structures Using 3D Circuits

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All Science Journal Classification (ASJC) codes

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