Reactive arc deposition is a very complex non-linear process in which many parameters are involved. These parameters can be either dependent or independent variables. Consequently, it is difficult to control the process by experimental observations. Therefore, for a better understanding of reactive arc evaporation mechanisms and proper selection of appropriate plasma and deposition conditions, a simple model based on reaction kinetics and energy balance should be defined. According to this model it is possible to predict phenomena occurring at the cathode and influencing the reactive deposition at the substrate. For reactive arc deposition of TiN films, this model will deal with poisining and gettering effects of nitrogen and titanium respectively. It will emphasize their influence on the evaporation rate, deposition rate and subsequently emission and deposition of the microparticles. Experimental results and measurements on reactive arc deposition of TiN are reported and verified using the theoretical model.
All Science Journal Classification (ASJC) codes
- Condensed Matter Physics
- Surfaces and Interfaces
- Surfaces, Coatings and Films
- Materials Chemistry