Multiscale modeling of degradation and failure of interconnect lines driven by electro migration and stress gradients

Robert Atkinson, Alberto Cuitiño

Research output: Chapter in Book/Report/Conference proceedingChapter

Abstract

This article introduces a multiscale modeling approach for simulating a key aspect affecting the reliability in narrow interconnect lines: migration, growth and coalescence of voids driven by electromigration and stress gradients. This approach is based on the Monte Carlo method with a Hamiltonian that contains both short-range and long-range interactions. The short-range interactions are resolved at atomic scale while the contributions of the long-range interaction are computed by solving a subsidiary continuum boundary value problem for the elastic and electric field. Thus, this approach combines both discrete and continuum techniques to provide a numerical tool to follow the complex evolving topologies that are derived from void migration, growth and coalescence. The predicted results are in good agreement with key experimental observations and other numerical and theoretical estimates.

Original languageEnglish (US)
Title of host publicationComputational Methods In Large Scale Simulation
PublisherWorld Scientific Publishing Co.
Pages335-383
Number of pages49
ISBN (Electronic)9789812701084
DOIs
StatePublished - Jan 1 2005
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Mathematics(all)

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