An experimental study is carried out on the thermal interaction between two finite-sized heat sources, such as heat dissipating electronic components, located on a flat surface. The horizontal and vertical surface orientations are studied. Both the natural convection dominated and mixed convective flows are investigated for the horizontal orientation of the surface. The problem studied is related to the positioning of finite-sized electronic components in electronic systems. The results obtained indicate that in the natural convection dominated flow, the orientation of the surface has a very strong effect on the interaction of the wakes from the heat sources. Mixed convective flow is found to be significantly more effective in reducing the surface temperature of the heat sources than the natural convection dominated flow. The relevance of the results obtained to the placement of heat dissipating electronic components in electronic systems is outlined.
|Original language||English (US)|
|Number of pages||9|
|Journal||American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD|
|Publication status||Published - Dec 1 1987|
All Science Journal Classification (ASJC) codes
- Mechanical Engineering
- Fluid Flow and Transfer Processes