Novel FEM Models of Intermodulation Effects in BAW and SAW Devices

Xiangnan Pang, Yook Kong Yong

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The nonlinear intermodulation effect in piezoelectric devices was studied By using the three-dimensional equations of nonlinear piezoelectricity and the method of harmonic balance, we have formulated and derived coupled sets of nonlinear piezoelectric equations in the frequency domain for intermodulation effects. The coupled sets of equations could be embedded in COMSOL FEM models. In order to check the validity and accuracy of the FEM models we studied the third order intermodulation effects in AT-cut quartz resonators. Our three-dimensional FEM model results compared well with the analytical one-dimensional results by Tiersten and with the experimental results by Smythe. The FEM models could be used for simulating intermodulation effects in BAW and SAW piezoelectric devices provided that the nonlinear material constants are available and are accurate.

Original languageEnglish (US)
Title of host publication2019 IEEE International Ultrasonics Symposium, IUS 2019
PublisherIEEE Computer Society
Pages177-180
Number of pages4
ISBN (Electronic)9781728145969
DOIs
StatePublished - Oct 2019
Event2019 IEEE International Ultrasonics Symposium, IUS 2019 - Glasgow, United Kingdom
Duration: Oct 6 2019Oct 9 2019

Publication series

NameIEEE International Ultrasonics Symposium, IUS
Volume2019-October
ISSN (Print)1948-5719
ISSN (Electronic)1948-5727

Conference

Conference2019 IEEE International Ultrasonics Symposium, IUS 2019
CountryUnited Kingdom
CityGlasgow
Period10/6/1910/9/19

All Science Journal Classification (ASJC) codes

  • Acoustics and Ultrasonics

Keywords

  • bulk acoustic waves (BAW)
  • finite element method (FEM)
  • Intermodulation distortion effect
  • nonlinear acoustoelectric behaviors
  • quartz resonators
  • surface acoustic waves (SAW)

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  • Cite this

    Pang, X., & Yong, Y. K. (2019). Novel FEM Models of Intermodulation Effects in BAW and SAW Devices. In 2019 IEEE International Ultrasonics Symposium, IUS 2019 (pp. 177-180). [8926068] (IEEE International Ultrasonics Symposium, IUS; Vol. 2019-October). IEEE Computer Society. https://doi.org/10.1109/ULTSYM.2019.8926068