@inproceedings{67d6475b0a584b7db662a2920768fb2f,
title = "Paper as a substrate and smart material for electronics, packaging, and robotics",
abstract = "As a material, cellulose/paper has attracted significant attention for its fibrous and bendable properties. Paper is a renewable resource with the most common forms coming from trees. This brief article describes efforts to create electronics on and in paper. Examples of electronics on paper include touch sensors and cold plasma-based sanitizers. The skin-like touch sensors use capacitance and patterned resistive networks for passive, scalable sensing with a reduced number of interconnects. When touched or wetted with water, the interdigitated electrodes in the resistive networks detect significant changes in electrical impedance. The plasma generators with layered and patterned sheets of paper use a simple and flexible format for dielectric barrier discharge to create atmospheric plasma without an applied vacuum. Examples of electronics in paper include sheets with tunable electrical conductivity and piezoresistive force sensors, along with functionalized paper-based electrodes capable of detecting small proteins and clinically relevant biomarkers. These papertronic devices have the potential to supply multi-functionality to new forms of smart bandages, skin-like sensing, food packaging, and robotic sensing and actuation. ",
keywords = "cellulose, cold plasma, electrochemical sensing, electronics, packaging, paper, robotics, skin-like sensing",
author = "Mazzeo, {Aaron D.} and Tongfen Liang and Xiyue Zou and Jingjin Xie and Ali Ashraf and Deepti Salvi and Francois Berthiaume and Pal, {Ramendra K.}",
note = "Funding Information: ACKNOWLEDGMENT We are grateful for support from NSF, the USDA, and the US DoD to push understanding of papertronic devices for skinlike sensing, wearable sensors, food packaging, and wound healing. We also acknowledge co-authors on previously published works and works in progress: Qiang Chen, Poornima Suresh, Subrata Roy, Jim White, Chuyang Chen, Nicole Gillette-Henao, Jihoon Oh, Jonathan Tumalle, Michael Yang, Cora LoPresti, Smit Shukla, Meriem Akin, Brian Weil, Salman Hoque, Emily Gruber, Hyun Jun Hwang, Suneel Kumar, Hao-Wei Yen, Siddhant Naik, Hwan June Kang, Mark Orzeszko, Harish Devaraj, Rajiv Malhotra, and Qingyang Wang, Funding Information: The authors are grateful for support from NSF Grants 1610933, 1653584 and 1643036, DoD PRMRP Grant W81XWH-19-1-0629, USDA Grant 2020-67017-31260, the Rutgers School of Engineering, the Rutgers-New Brunswick Honors College, and the China Scholarship Council. Publisher Copyright: {\textcopyright} 2021 IEEE.; 2021 IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2021 ; Conference date: 20-06-2021 Through 23-06-2021",
year = "2021",
month = jun,
day = "20",
doi = "10.1109/FLEPS51544.2021.9469859",
language = "English (US)",
series = "FLEPS 2021 - IEEE International Conference on Flexible and Printable Sensors and Systems",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "FLEPS 2021 - IEEE International Conference on Flexible and Printable Sensors and Systems",
address = "United States",
}