Paper as a substrate and smart material for electronics, packaging, and robotics

Aaron D. Mazzeo, Tongfen Liang, Xiyue Zou, Jingjin Xie, Ali Ashraf, Deepti Salvi, Francois Berthiaume, Ramendra K. Pal

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

As a material, cellulose/paper has attracted significant attention for its fibrous and bendable properties. Paper is a renewable resource with the most common forms coming from trees. This brief article describes efforts to create electronics on and in paper. Examples of electronics on paper include touch sensors and cold plasma-based sanitizers. The skin-like touch sensors use capacitance and patterned resistive networks for passive, scalable sensing with a reduced number of interconnects. When touched or wetted with water, the interdigitated electrodes in the resistive networks detect significant changes in electrical impedance. The plasma generators with layered and patterned sheets of paper use a simple and flexible format for dielectric barrier discharge to create atmospheric plasma without an applied vacuum. Examples of electronics in paper include sheets with tunable electrical conductivity and piezoresistive force sensors, along with functionalized paper-based electrodes capable of detecting small proteins and clinically relevant biomarkers. These papertronic devices have the potential to supply multi-functionality to new forms of smart bandages, skin-like sensing, food packaging, and robotic sensing and actuation.

Original languageEnglish (US)
Title of host publicationFLEPS 2021 - IEEE International Conference on Flexible and Printable Sensors and Systems
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728191737
DOIs
StatePublished - Jun 20 2021
Externally publishedYes
Event2021 IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2021 - Virtual, Online
Duration: Jun 20 2021Jun 23 2021

Publication series

NameFLEPS 2021 - IEEE International Conference on Flexible and Printable Sensors and Systems

Conference

Conference2021 IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2021
CityVirtual, Online
Period6/20/216/23/21

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Instrumentation

Keywords

  • cellulose
  • cold plasma
  • electrochemical sensing
  • electronics
  • packaging
  • paper
  • robotics
  • skin-like sensing

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