Process selection for microfluidic device manufacturing

Aaron D. Mazzeo, Matthew Dirckx, David E. Hardt

Research output: Contribution to conferencePaperpeer-review

2 Scopus citations

Abstract

The emerging demand for microfluidic devices is driving decisions for product and manufacturing development. Three potential categories for microfluidic device manufacturing are hot embossing, injection molding, and liquid resin molding. We review the first two, along with two sub-categories of liquid resin molding: polydimethylsiloxane (PDMS) casting and UV embossing. We address the processes' strengths and weaknesses with respect to cost, material selection, tooling, temperature requirements, pressure requirements, feature sizes, aspect ratios, and rates. Based on the strengths, weaknesses, and processing parameters of these four micro replication techniques, we provide a table to aid in proper process selection.

Original languageEnglish (US)
Pages1997-2001
Number of pages5
StatePublished - 2007
Externally publishedYes
EventSociety of Plastics Engineers Annual Technical Conference: Plastics Encounter at ANTEC 2007 - Cincinnati, OH, United States
Duration: May 6 2007May 11 2007

Other

OtherSociety of Plastics Engineers Annual Technical Conference: Plastics Encounter at ANTEC 2007
Country/TerritoryUnited States
CityCincinnati, OH
Period5/6/075/11/07

All Science Journal Classification (ASJC) codes

  • Chemical Engineering(all)
  • Polymers and Plastics

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