Angle-resolved x-ray photoelectron spectroscopy (AR-XPS) is utilized in this work to accurately and nondestructively determine the nitrogen concentration and profile in ultrathin SiOxNy films. With furnace growth at 800-850 °C using nitric oxide (NO) and oxygen, 1013-1015 cm-2 of nitrogen is incorporated in the ultrathin (≤4 nm) oxide films. Additional nitrogen can be incorporated by low energy ion (15N2) implantation. The nitrogen profile and nitrogen chemical bonding states are analyzed as a function of the depth to understand the distribution of nitrogen incorporation during the SiOxNy, thermal growth process. AR-XPS is shown to yield accurate nitrogen profiles that agree well with both medium energy ion scattering and secondary ion mass spectrometry analysis. Preferential nitrogen accumulation near the SiOxNy/Si interface is observed with a NO annealing, and nitrogen is shown to bond to both silicon and oxygen in multiple distinct chemical states, whose thermal stability bears implications on the reliability of nitrogen containing SiO2.
All Science Journal Classification (ASJC) codes
- Physics and Astronomy(all)