Single-step through-hole punching by hot embossing

Aaron D. Mazzeo, Matthew Dirckx, David E. Hardt

Research output: Contribution to conferencePaperpeer-review

2 Scopus citations

Abstract

Hot micro-embossing is a promising manufacturing technique for replicating millimeter to nanometer scale features, including fluidic channels, in thermoplastic parts. Complex microfluidic devices will require multiple functional layers as well as interlayer vias. We demonstrate a mated aluminum tool pair with integrated punch and die features. The punched hole diameters are approximately 500 μm, 740 μm, 1.0 mm, and 2.0 mm. The embossed through-holes were punched in PMMA at 120°C with a velocity of 0.5 mm/min. The tool set also demonstrates the feasibility of forming channels on both sides of the part and producing interface ports and interlayer vias in a single step.

Original languageEnglish (US)
Pages2931-2935
Number of pages5
StatePublished - 2007
Externally publishedYes
EventSociety of Plastics Engineers Annual Technical Conference: Plastics Encounter at ANTEC 2007 - Cincinnati, OH, United States
Duration: May 6 2007May 11 2007

Other

OtherSociety of Plastics Engineers Annual Technical Conference: Plastics Encounter at ANTEC 2007
Country/TerritoryUnited States
CityCincinnati, OH
Period5/6/075/11/07

All Science Journal Classification (ASJC) codes

  • Chemical Engineering(all)
  • Polymers and Plastics

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