Substrate engineering for 32nm and beyond

Bich Yen Nguyen, Carlos Mazuré, George Celler

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

As Si CMOS technology progresses to more advanced nodes, classical scaling is no longer sufficient to follow Moore's law. A transition to engineered substrate technology is essential, as exemplified by SOI and its more advanced adaptations. The advances in engineered substrates and some key applications are described.

Original languageEnglish (US)
Title of host publication2009 International Conference on Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors, ULSIC vs. TFT
PublisherElectrochemical Society Inc.
Pages91-98
Number of pages8
Edition1
ISBN (Electronic)9781607680857
ISBN (Print)9781607682646
DOIs
StatePublished - 2009
Externally publishedYes
Event2nd International Conference on Semiconductor Technology for Ultra Large Integrated Circuits and Thin Film Transistors, ULSIC vs. TFT II - Xian, China
Duration: Jul 5 2009Jul 10 2009

Publication series

NameECS Transactions
Number1
Volume22
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Other

Other2nd International Conference on Semiconductor Technology for Ultra Large Integrated Circuits and Thin Film Transistors, ULSIC vs. TFT II
Country/TerritoryChina
CityXian
Period7/5/097/10/09

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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