Thermal characterization of thin film Cu interconnects for the next generation of microelectronic devices

Shahab Shojaei-Zadeh, Shu Zhang, Wenjun Liu, Yizhang Yang, Sadegh M. Sadeghipour, Mehdi Asheghi, Per Sverdrup

Research output: Contribution to conferencePaperpeer-review

12 Scopus citations

Abstract

With the dramatic scaling of the transistors, the important issues like RC delay, electromigration failure and heat dissipation emerge, which need to be addressed urgently. Substitution of copper for aluminum has been suggested to reduce the RC delay of interconnects. While the electrical and mechanical properties of thin copper films have been extensively investigated; their thermal characterizations have received less attention. The lateral thermal conductivity of a 144 nm thick copper film is measured using the electrical resistance Joule heating and thermometry in a suspended bridge. The thermal conductivities at 300 K and 450 K are 240 and 280 W/m-K, respectively, which is smaller than the corresponding bulk values. The impact of the interconnect dimension and thermal conductivity on the self-heating is investigated as a function of interconnect via density. It is concluded that for via separation distances less than 5 μm, the combination of Cu interconnect and vias can significantly reduce the average temperature rise in multilayer interconnects.

Original languageEnglish (US)
Pages575-583
Number of pages9
StatePublished - 2004
Externally publishedYes
EventITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Las Vegas, NV, United States
Duration: Jun 1 2004Jun 4 2004

Other

OtherITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
Country/TerritoryUnited States
CityLas Vegas, NV
Period6/1/046/4/04

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

Keywords

  • Copper lines
  • Electrical resistivity
  • Interconnects
  • Thermal conductivity
  • Ultra thin copper films

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