Abstract
A TRILEVEL LIFT-OFF PROCESS IS DESCRIBED THAT INCORPORATES A HIGH-GLASS-TEMPERATURE POLYMER, POLYIMIDE. THIS PROCESS ALLOWS THE HIGH RESOLUTION PATTERNING OF REFRACTORY MATERIALS AT ELEVATED SUBSTRATE TEMPERATURES ( > 200 D. C). IT HAS BEEN SUCCESSFULLY USED TO PRODUCE PATTERNED SUPERCONDUCTING NIOBIUM FILMS WHOSE CRITICAL TEMPERATURES SUFFERED NO DEGRADATION COMPARED TO SIMULTANEOUSLY EVAPORATED, UNPATTERNED FILMS.
Original language | English (US) |
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Pages (from-to) | 33-35 |
Number of pages | 3 |
Journal | J VAC SCI TECHNOL |
Volume | V 21 |
Issue number | N 1 |
DOIs | |
State | Published - 1982 |
Externally published | Yes |
All Science Journal Classification (ASJC) codes
- Engineering(all)